ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,576, issued on Aug. 4, was assigned to Tokyo Electron Ltd. (Tokyo).
"Plasma processing apparatus and plasma processing method" was invented by Takashi Yamamura (Hsin-chu City, Taiwan), Chunhsiang Yang (Hsin-chu City, Taiwan) and Yasutaka Hama (Hsin-chu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A plasma processing apparatus for performing plasma processing on a substrate, includes: a chamber; a substrate support provided inside the chamber, including a region where the substrate is supported and an edge ring provided around the region, and configured to support the substrate inside the edge ring; a plasma generator provided inside th...