US Patent Issued to Tokyo Electron on Aug. 25 for "Substrate processing method and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,084, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Gentaro Goshi (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method performed in a substrate processing apparatus configured to process a substrate by bringing the substrate into contact with a processing fluid in a supercritical state is provided. The substrate processing apparatus includes: a processing vessel having a processing space; a main supply line configured to supply the processing fluid to the processing space; a discharge line having a first opening/clo...