US Patent Issued to Tokyo Electron on Aug. 25 for "Substrate processing apparatus and transfer method" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,106, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and transfer method" was invented by Takayasu Kiyokawa (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a substrate processing apparatus comprising: a first placement chamber; a second placement chamber; a transfer robot; and a controller. The controller is configured to: a) control the apparatus such that a position of an object on a fork of the transfer robot is detected as a first position when unloading the object from the first placement chamber; b) control the apparatus such that the object is unloaded from the fi...