US Patent Issued to Tokyo Electron on Aug. 25 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,107, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Hayato Tanoue (Kikuchi-gun, Japan), Kento Araki (Kikuchi-gun, Japan), Yohei Yamashita (Kikuchi-gun, Japan) and Gousuke Shiraishi (Kikuchi-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are stacked on top of each other includes a substrate holder configured to hold the combined substrate; a laser radiating unit configured to radiate laser light to a laser absorbing fil...