US Patent Issued to Tokyo Electron on Aug. 25 for "Method for processing a substrate" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,114, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Method for processing a substrate" was invented by Eric Chih-Fang Liu (Albany, N.Y.), Sophie Thibaut (Albany, N.Y.), Nicholas Joy (Albany, N.Y.) and Christopher Cole (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for processing a substrate includes forming a first hardmask layer over a target layer and a second hardmask layer over the first hardmask layer, and patterning the second hardmask layer. The method further includes forming a tone inversion mask between portions of the patterned second hardmask layer, removing the patterned second hardmask layer, pa...