US Patent Issued to Tokyo Electron on Aug. 18 for "System and method for plasma processing" (New York Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,712,152, issued on Aug. 18, was assigned to Tokyo Electron Ltd. (Tokyo).

"System and method for plasma processing" was invented by Sergey Voronin (Albany, N.Y.), Nicholas Smieszek (Albany, N.Y.), Qi Wang (Albany, N.Y.), Akiteru Ko (Albany, N.Y.) and Carl Smith (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for plasma processing includes biasing a substrate by ramping a sheath voltage during a first phase of a plasma process and removing sidewall charge buildup on a feature of the substrate in an absence of substrate biasing during a second phase of the plasma process."

The patent was filed on Feb. 6, 2024, under Application No. 1...