US Patent Issued to Tokyo Electron on Aug. 18 for "Back end of line (BEOL) interconnection approach" (New York Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,884, issued on Aug. 18, was assigned to Tokyo Electron Ltd. (Tokyo).

"Back end of line (BEOL) interconnection approach" was invented by Peng Wang (Albany, N.Y.) and Emilia Hirsch (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method during a back-end-of-line (BEOL) process for making a semiconductor device includes forming a first dielectric layer over a metal layer disposed on a substrate and a first etch stop layer over the first dielectric layer, forming a via that extends through the first etch stop layer and the first dielectric layer, filling the via with a sacrificial material, forming a second dielectric layer over the first ...