US Patent Issued to Tokyo Electron on Aug. 11 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,936, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Yoshinori Ikeda (Koshi City, Japan) and Toru Hirata (Koshi City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a holder for holding a substrate horizontally, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, the rotator, and the liquid supplier. The holder includes a turntable configured to be rotated by the rotator, at least one first clamper configured to be rotated ...