ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,704,785, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo).

"Point of use solvent mixing for film removal" was invented by Lior Huli (Delmar, N.Y.) and Corey Lemley (Troy, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a wafer that includes: positioning the wafer within a processing chamber, the wafer including a film deposited over a surface of the wafer; rotating the wafer within the processing chamber; mixing a first fluid with a second fluid at a mixing ratio using a dispense nozzle assembly resulting in a fluid mixture; and while rotating the wafer, dispensing the fluid mixture from the dispense nozzle assem...