ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,919, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo).
"Bonding apparatus and bonding method" was invented by Tokutarou Hayashi (Kikuchi gun, Japan), Yoshitaka Otsuka (Koshi, Japan), Yasutaka Mizomoto (Kikuchi-gun, Japan), Kazuya Ikeue (Kikuchi-gun, Japan) and Munehisa Kodama (Kikuchi-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus is configured to bond a first substrate and a second substrate to prepare a combined substrate. The first substrate includes a base substrate, and a device layer formed on a surface of the base substrate facing the second substrate. The bonding apparatus includes a first holder ...