ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,959, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo).
"Temperature controlling method and substrate processing apparatus" was invented by Dai Igarashi (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system acquires a temperature TB of a temperature-controlling medium before a temperature change during execution of a plurality of processes n (n is identifier of process and is natural number that is greater than one) in each of which heat is input to a substrate placed on a placement surface of a stage, wherein the placement surface on which the substrate is placed is formed on the stage, a flow path through which the te...