US Patent Issued to Tokyo Electron on April 7 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,559, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Koji Sasaki (Yamanashi, Japan), Katsuyuki Higashi (Yamanashi, Japan) and Yuji Seshimo (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method performed by a substrate processing apparatus including: a processing container that processes a substrate; a gas supply that supplies a gas into the processing container; an exhaust device that exhausts a gas from an inside of the processing container; and a gas analyzer that analyzes the gas passing through an exhaust pipe...