ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,563, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method" was invented by Hiroshi Hirose (Nirasaki, Japan), Masaomi Kobe (Nirasaki, Japan), Koichi Miyashita (Nirasaki, Japan), Takafumi Nogami (Nirasaki, Japan), Kenichi Kote (Nirasaki, Japan) and Kouji Iihoshi (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes: a step of preparing a substrate in a chamber of a substrate processing apparatus; a step of correcting a set power value based on a correction value Y from Equation (1), coefficients A, B, C, and D, and a variable X indicating a processed amount of the...