US Patent Issued to Tokyo Electron on April 7 for "Film thickness measuring device, film forming system, and film thickness measuring method" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,999, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo).

"Film thickness measuring device, film forming system, and film thickness measuring method" was invented by Yusuke Kikuchi (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film thickness measuring device includes: a stage on which a substrate is disposed; a light emitter/receiver configured to emit light for measuring a film thickness to the substrate disposed on the stage and receive a reflected light from the substrate disposed on the stage; a rotation mechanism configured to rotate the stage; an orientation detector configured to detect an orientation of the st...