US Patent Issued to Tokyo Electron on April 7 for "Fabricating three-dimensional semiconductor structures" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,747, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo).

"Fabricating three-dimensional semiconductor structures" was invented by Soo Doo Chae (Albany, N.Y.), Lior Huli (Albany, N.Y.), Steven Gueci (Albany, N.Y.), Hojin Kim (Albany, N.Y.), Henan Zhang (Albany, N.Y.) and Na Young Bae (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In certain embodiments, a method includes forming, on a substrate by spin-on deposition, a layer stack of alternating layers of first and second carbon-containing materials. The layers of the first carbon-containing material include an agent-generating ingredient for generating a solubility-changing...