ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,048, issued on April 14, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film forming method and film forming apparatus" was invented by Yoshihiro Kato (Yamanashi, Japan), Junya Suzuki (Yamanashi, Japan), Toshio Hasegawa (Yamanashi, Japan) and Kouji Shimomura (Yamanashi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method according to an aspect of the present disclosure is a film forming method of embedding a film in a recess formed in a surface of a substrate, and includes a first processing including (a) adsorbing a raw material gas into the recess, (b) forming a film by reacting a reaction gas with the raw material gas, and ...