US Patent Issued to Tokyo Electron, University of Yamanashi on Sept. 8 for "Film forming method and film forming apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,415, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo) and University of Yamanashi (Kofu, Japan).

"Film forming method and film forming apparatus" was invented by Takashi Fuse (Nirasaki, Japan), Yusuke Kubota (Fuchu, Japan), Shuji Azumo (Nirasaki, Japan) and Tetsuya Sato (Kofu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method selectively performs film formation. The film forming method includes a cooling operation and a film forming operation. The cooling operation includes cooling a substrate to a temperature at which molecules of a c-C4F8 gas and a SF6 gas condense on a surface of the substrate, the substrate...