US Patent Issued to Tokyo Electron, TOHOKU UNIVERSITY on May 5 for "Plasma processing apparatus and plasma processing method" (Japanese Inventor)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,563, issued on May 5, was assigned to Tokyo Electron Ltd. (Tokyo) and TOHOKU UNIVERSITY (Miyagi, Japan).

"Plasma processing apparatus and plasma processing method" was invented by Masaki Hirayama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique capable of improving plasma uniformity in a parallel plate-type plasma processing apparatus having a plasma excitation frequency of a VHF band or an UHF band. A plasma processing apparatus according to an exemplary embodiment includes a process container, a stage provided in the process container, a dielectric plate provided above the upper surface of the stage via a space in ...