ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,461, issued on April 21, was assigned to TOKUYAMA Corp. (Shunan, Japan).
"Laminate for circuit board" was invented by Eiki Tsushima (Chitose, Japan), Ryuji Ishimoto (Shunan, Japan) and Masakatsu Maeda (Shunan, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The laminate for a circuit board of the present invention is a laminate including a metal nitride sintered board and a copper sheet, and the laminate has a size with a minimum length from a center of a plane to a peripheral edge of 50 mm or more, and has a void ratio X of 0.50% or less, which is a ratio of a total length LB of voids having a diameter of 1 micro metre or more confirmed in th...