US Patent Issued to TOHOKU UNIVERSITY, CANON ANELVA on March 24 for "Method for atomic diffusion bonding and bonded structure" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,204, issued on March 24, was assigned to TOHOKU UNIVERSITY (Sendai, Japan) and CANON ANELVA Corp. (Kawasaki, Japan).

"Method for atomic diffusion bonding and bonded structure" was invented by Takehito Shimatsu (Sendai, Japan), Miyuki Uomoto (Sendai, Japan), Kazuo Miyamoto (Saitama, Japan), Yoshikazu Miyamoto (Saitama, Japan), Nobuhiko Katoh (Kawasaki, Japan), Takayuki Moriwaki (Kawasaki, Japan) and Takayuki Saitoh (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Atomic diffusion bonding is carried out using a bonding film comprising a nitride formed at a bonding surface. Operating in a vacuum chamber, a bonding film comprising a nitr...