US Patent Issued to ThinSiC on Feb. 24 for "Carbon assisted semiconductor dicing and method" (California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,068, issued on Feb. 24, was assigned to ThinSiC Inc. (Santa Clara, Calif.).

"Carbon assisted semiconductor dicing and method" was invented by Tirunelveli Subramaniam Ravi (San Jose, Calif.), Stephen Daniel Miller (San Jose, Calif.), Jinho Seo (Saratoga, Calif.) and Ashraf Ahmed El dakrouri (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate is configured for dicing into separate die or individual semiconductor devices. The semiconductor substrate can comprise silicon, silicon carbide, or gallium nitride. A dicing grid bounds each semiconductor device on the semiconductor substrate. A die singulation process ...