US Patent Issued to THE UNIVERSITY OF OSAKA on Sept. 15 for "Dissimilar material solid phase bonding method, and dissimilar material solid phase bonded structure" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,603, issued on Sept. 15, was assigned to THE UNIVERSITY OF OSAKA (Suita, Japan).

"Dissimilar material solid phase bonding method, and dissimilar material solid phase bonded structure" was invented by Hidetoshi Fujii (Suita, Japan), Yoshiaki Morisada (Suita, Japan) and Yasuhiro Aoki (Suita, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides dissimilar material solid phase bonding with which a robust bonded portion of metal materials having different compositions can be formed efficiently. The present invention also provides a dissimilar material solid phase bonded structure having a dissimilar material solid phase bo...