US Patent Issued to THE UNIVERSITY OF CHICAGO on Aug. 11 for "Strain-insensitive soft pressure sensor and method of measuring pressure" (Illinois Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,702,302, issued on Aug. 11, was assigned to THE UNIVERSITY OF CHICAGO (Chicago).

"Strain-insensitive soft pressure sensor and method of measuring pressure" was invented by Sihong Wang (Chicago), Qi Su (Chicago) and Yang Li (Chicago).

According to the abstract* released by the U.S. Patent & Trademark Office: "A soft pressure sensor comprises a stretchable top electrode, a stretchable bottom electrode, and an array of peaked structures between the stretchable top and bottom electrodes. The peaked structures comprise protruding regions of a continuous film conformally overlying an array of stiffening electrodes on the stretchable bottom electrode, where a tip of each protruding region i...