US Patent Issued to The Phoenix Company of Chicago on June 9 for "Impedance matched via connections in a printed circuit board" (Connecticut Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,757, issued on June 9, was assigned to The Phoenix Co. of Chicago Inc. (Naugatuck, Conn.).

"Impedance matched via connections in a printed circuit board" was invented by Sri Satya Parthiva Sumanam (Naugatuck, Conn.) and Salvatore J. Gullotta Sr. (Naugatuck, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Vertical launch impedance matched through-hole vias to ensure proper impedance matching is maintained after a printed circuit board connector is attached to a printed circuit board. A conductive via having a center aperture and a via body having a slot adjacent either the via top surface and/or via bottom surface, and a dielectric component inse...