US Patent Issued to THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY on Nov. 3 for "Polymer hole-transporting materials and application thereof" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,632, issued on Nov. 3, was assigned to THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Hong Kong).

"Polymer hole-transporting materials and application thereof" was invented by He Yan (Hong Kong) and Shangshang Chen (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses several kinds of polymer hole-transporting material, comprising homopolymers or copolymers. The present invention also shows application in inverted-structure perovskite solar cells."

The patent was filed on June 11, 2025, under Application No. 19/234,709.

*For further information, including images, charts and tables, please visit: http://patft...