US Patent Issued to The Hong Kong Polytechnic University on June 30 for "Heat transfer device and system" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,481, issued on June 30, was assigned to The Hong Kong Polytechnic University (Hong Kong).

"Heat transfer device and system" was invented by Xiaoming Tao (Hong Kong), Ying Xiong (Hong Kong), Shengyang Tang (Hong Kong), Jing Yang (Hong Kong) and Mingyue Zhu (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat transfer device for applying a varying temperature to a portion of an animate body comprises a liquid conduit. The liquid conduit is liquidly connectable to an external first liquid source to establish a first circulation loop for transporting a first liquid. The liquid conduit is liquidly connectable to an external second liquid sour...