US Patent Issued to The Heil on May 5 for "Pack through eject panel" (Canadian Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,617,608, issued on May 5, was assigned to The Heil Co. (Chattanooga, Tenn.).

"Pack through eject panel" was invented by Claude Boivin (Levis, Canada), Eric Boivin (Quebec, Canada) and Hugo Marsan (Drummondville, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is disclosed a waste collecting device having a container for receiving waste therein. The container has an end wall and an ejector panel. The container encloses a waste receiving volume. The ejector panel has an opening therethrough for allowing access to the waste receiving volume for receiving the waste. The waste collecting device further has a compactor outside the waste receiving vo...