US Patent Issued to TEXAS INSTRUMENTS on Sept. 8 for "Configurable leaded package" (Texas Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,558, issued on Sept. 8, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Configurable leaded package" was invented by Sreenivasan Kalyani Koduri (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base insulating layer; a semiconductor die attached to a portion of the base insulating layer; and a first continuous lead electrically connected to the semiconductor die. The first continuous lead includes a first lateral extension on a first surface of the base insulating layer, a second lateral extension on a second surface of the base insulating layer, and a connecting portion between the first lateral extension a...