US Patent Issued to TEXAS INSTRUMENTS on Oct. 6 for "Electronic device with high draft angle package structure" (Malaysian Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,753, issued on Oct. 6, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Electronic device with high draft angle package structure" was invented by Wei Fen Sueann Lim (Melaka, Malaysia), Jeevintharan A/L Sivasankaran (Negeri Sembilan, Malaysia), Khair Khaizal (Seremban, Malaysia) and Edwin Jin Keong Lim (Kuala Lumpur, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a molded package structure and a conductive lead partially exposed outside the package structure, the package structure having lateral sides extending at an angle that is greater than 15 degrees and 25 degrees or less to facilitate mold cavity filling ...