ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,954, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Shape memory polymer for use in semiconductor device fabrication" was invented by Steven Alfred Kummerl (Carrollton, Texas) and Benjamin Stassen Cook (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate."

The patent was filed on Nov. 29, 2022, under Application No. 18/059,473.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearc...