US Patent Issued to TEXAS INSTRUMENTS on Oct. 27 for "Methods and apparatus for semiconductor packages with window assemblies" (Texas Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,205, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Methods and apparatus for semiconductor packages with window assemblies" was invented by Jane Liu (Plano, Texas), Osvaldo Enriquez (Lewisville, Texas) and Rafael S. Mendoza (Richardson, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, apparatus, articles of manufacture, and methods to reduce delamination of layers in semiconductor packages with window assemblies are disclosed. An apparatus comprising: a translucent panel, a semiconductor substrate, a stack of bonding materials between the translucent panel and the semiconductor substrate, and a buffer material ext...