ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,724, issued on March 31, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Smart scan options to improve wafer die yield" was invented by Rakul Viswanath (Bengaluru, India), Sachin Aithal (Bengaluru, India) and Gunvarun Sudan (Bengaluru, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit includes: channel signal chains; configuration registers including a configuration register for each of the channel signal chains; channel data registers including a channel data register for each of the channel signal chains; a first communication interface coupled to the configuration registers via a daisy-chain connection; a second communication inte...