ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,738, issued on March 31, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Flip chip package for semiconductor devices" was invented by Yiqi Tang (Allen, Texas), Jie Chen (Plano, Texas), Chittranjan Mojan Gupta (Richardson, Texas) and Rajen Muricon Murugan (Dallas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, an apparatus includes: a multilayer package substrate including a die mount area on a die side surface and comprising power pads and ground pads on an opposing board side surface, the multilayer package substrate including post connect locations on the die side surface for receiving power post connects and for receivin...