US Patent Issued to TEXAS INSTRUMENTS on March 24 for "Flexible substrates having semiconductor packages" (American, Indian Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,311, issued on March 24, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Flexible substrates having semiconductor packages" was invented by Bradley Andrew Glasscock (Forney, Texas), Nagesh Surendranath (Frisco, Texas) and Shriram Devi (Pune, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, an electronic device comprises a semiconductor package including a semiconductor die and a set of conductive members coupled to the semiconductor die, the set of conductive members coupled to a bottom surface of the semiconductor package. The package also includes a conductive terminal coupled to the semiconductor die and exposed to the bottom ...