US Patent Issued to TEXAS INSTRUMENTS on June 16 for "Quad flat no-lead (QFN) manufacturing process" (Malaysian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,639, issued on June 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Quad flat no-lead (QFN) manufacturing process" was invented by Hong Seng Lau (Kuala Lumpur, Malaysia) and Wai Kong Soo (Selangor, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lead frame includes a metal structure having opposite first and second sides and prospective device portions having leads with first and second lateral sides extending from a tie bar toward a die attach pad. One or more of the leads includes a first indent in the first lateral side that extends to the first side of the metal structure, and a second indent that extends to the second side of th...