US Patent Issued to TEXAS INSTRUMENTS on June 16 for "Marchand baluns in coreless package substrates" (Texas Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,632, issued on June 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Marchand baluns in coreless package substrates" was invented by Harshpreet Singh Phull Bakshi (Dallas), Sylvester Ankamah-Kusi (Dallas), Siraj Akhtar (Dallas) and Rajen Manicon Murugan (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a semiconductor package comprises a conductive terminal; a semiconductor die including a device side having circuitry formed therein, the device side facing toward the conductive terminal; and a substrate coupled to the conductive terminal and to the device side of the semiconductor die. The substrate includes a first metal laye...