US Patent Issued to TEXAS INSTRUMENTS on July 28 for "Semiconductor package with flip chip solder joint capsules" (Philippine Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,771, issued on July 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor package with flip chip solder joint capsules" was invented by James Raymond Maliclic Baello (Pampanga, Philippines) and Steffany Ann Lacierda Moreno (Bamban, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a leadframe forming a plurality of leads with a die attach site, a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints, a set of solder joint ...