US Patent Issued to TEXAS INSTRUMENTS on July 28 for "Semiconductor device package with open sensor cavity" (Philippine Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,793, issued on July 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor device package with open sensor cavity" was invented by Jeffrey Salvacion Solas (Angeles City, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example semiconductor device package includes a semiconductor die including an environmental sensor on a device side surface mounted to a package substrate; a barrier comprising a polyimide dry film photoresist material surrounding the environmental sensor on the device side surface of the semiconductor die, the barrier having an interior side facing the environmental sensor and having an opposing exterior si...