US Patent Issued to TEXAS INSTRUMENTS on July 28 for "Microelectronic device package with integrated antenna" (Texas Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,172, issued on July 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Microelectronic device package with integrated antenna" was invented by Juan Alejandro Herbsommer (Allen, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled...