US Patent Issued to TEXAS INSTRUMENTS on July 21 for "Integrated circuit package with multiple interconnects" (Malian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,470, issued on July 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Integrated circuit package with multiple interconnects" was invented by Huay Yann Tay (Melaka, Mali), Wei Li Julien Mok (Melaka, Mali) and You Chye How (Melaka Tengah, Mali).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package includes a mold compound. A first interconnect of the IC package is encased in the mold compound. The first interconnect includes a first set of leads protruding from a first side of the mold compound along a first row and a second set of leads protruding from a second side of the mold compound along a second row, wherein the ...