US Patent Issued to TEXAS INSTRUMENTS on July 21 for "Bulk acoustic wave resonator with an integrated passive device fabricated using bump process" (California, Texas Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,355, issued on July 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Bulk acoustic wave resonator with an integrated passive device fabricated using bump process" was invented by Ting-Ta Yen (San Jose, Calif.), Yao Yu (San Jose, Calif.) and Hassan Omar Ali (Murphy, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit includes a semiconductor substrate and an integrated passive device. The integrated passive device is on a surface of the semiconductor substrate. The integrated passive device is in a metal layer on the semiconductor substrate. The metal layer is at least tens of micrometers thick. The integrated passive device may be an...