US Patent Issued to TEXAS INSTRUMENTS on July 14 for "Flip chip packaged devices with thermal interposer" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,169, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Flip chip packaged devices with thermal interposer" was invented by Vivek Arora (San Jose, Calif.), Woochan Kim (San Jose, Calif.) and Anindya Poddar (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, an apparatus includes: a package substrate having a die mount surface; semiconductor die flip chip mounted to the package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the active surface of...