ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,021, issued on Aug. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Substrate-on-die package architecture" was invented by Rajen Murugan (Dallas), Yiqi Tang (Allen, Texas) and Sylvester Ankamah-Kusi (Dallas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged semiconductor device includes a lead frame and a semiconductor die. The semiconductor die has first and second opposing sides, and the first side of the die is mounted to the lead frame. A first set of bond wires and/or bump bonds are configured to electrically couple the die to the lead frame. A passive circuit element is on a substrate, and the substrate is mounted to the second side...