US Patent Issued to TEXAS INSTRUMENTS on Aug. 4 for "Multilevel package substrate for interlevel dielectric crack mitigation" (Texas Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,007, issued on Aug. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Multilevel package substrate for interlevel dielectric crack mitigation" was invented by Guangxu Li (Allen, Texas), Sylvester Ankamah-Kusi (Dallas) and Rajen Murugan (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a multilevel package substrate and a semiconductor die, where the multilevel package substrate has first and second levels in respective first and second planes in a stack, the first level including a first conductive feature, and the second level including a second conductive feature, and the semiconductor die has a conductive peri...