ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,182, issued on Aug. 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Microelectronic device package including inductor and semiconductor device" was invented by Jie Chen (Plano, Texas), Rajen Maricon Murugan (Dallas), Chittranjan Mohan Gupta (Richardson, Texas) and Yiqi Tang (Allen, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes: a first conductor layer patterned into parallel strips having a first end and an opposite second end formed on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to on...