ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,034, issued on Aug. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Sensor packages" was invented by Jomari Austria (Malabon City, Philippines) and Ray Fredric De Asis (Mabalacat, Philippines).
According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, semiconductor package comprises a semiconductor die having a device side including circuitry; a sensor on the device side; a metal ring on the device side to at least partially define a cavity vertically aligned with the sensor, with the metal ring having a top metal ring surface facing away from the semiconductor die and an exterior metal ring surface facing away from the sensor; and a metal pil...