US Patent Issued to Temper IP on June 30 for "System for heating components for curing and bonding multi-component structures" (Michigan Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,904, issued on June 30, was assigned to Temper IP LLC (Rockford, Mich.).

"System for heating components for curing and bonding multi-component structures" was invented by William C. Dykstra (Rockford, Mich.) and Luke A. Martin (Wyoming, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adaptable heating source includes an insulating substrate. A plurality of heating elements are at least partially disposed within the insulating substrate. The plurality of heating elements, when energized, generate heat. Each heating element of the plurality of heating elements includes a ferromagnetic material and an electrically conductive material. The ferro...