ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,253, issued on May 12, was assigned to TECHNISCHE UNIVERSITAT WIEN (Vienna).
"Method for preparing an adhesive tape or molding mass" was invented by Christoph Schnoll (Vienna), Robert Liska (Schleinbach, Austria), Patrick Knaack (Vienna), Moritz Mitterbauer (Vienna) and Daniel Grunenberg (Vienna).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polymerizable composition which may be used as an adhesive mass in a method for preparing an adhesive tape or as molding mass in a method for preparing molded articles is provided. The polymerizable composition contains: A) a thermal cationic initiator, or B) a combination of a cationic photoinitiator and a the...