ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,445, issued on July 21, was assigned to TE CONNECTIVITY SOLUTIONS GmbH (Schaffhausen, Switzerland).
"Pressure sensor package with a sensor die" was invented by David Eric Wagner (Fremont, Calif.), Weijun (Davy) Xie (Shenzhen, China) and Vincent Wong (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor includes a housing having a body and a plurality of ports, a plurality of diaphragms each disposed in one of the ports, and a package having a substrate and a sensor die attached to the substrate. The body has a first face, an opposite second face, and a plurality of passageways extending through the body. The ports extend from the ...