US Patent Issued to TE CONNECTIVITY SOLUTIONS on April 7 for "Connector with conductive layer" (North Carolina Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,597,726, issued on April 7, was assigned to TE CONNECTIVITY SOLUTIONS GmbH (Schaffhausen, Switzerland).

"Connector with conductive layer" was invented by Daniel Stack (Winston Salem, N.C.) and Sterling Vaden (Winston Salem, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connector includes a dielectric having a mating face, an inner contact disposed in the dielectric, and a conductive layer disposed on or within the mating face. The conductive layer is electrically isolated from the inner contact."

The patent was filed on May 17, 2023, under Application No. 18/318,803.

*For further information, including images, charts and tables, please visit: ...